Backplane Assembly

Features

Specifications

• End Application:
  Nsn 4940-01-471-6396, electronic shop, transportable; w/s: missile, patriot
• Part Name Assigned By Controlling Agency:
  Wirewrap board, assembly - mother board
• Federal Supply Class (fsc):
  Electrical and electronic assemblies, boards, cards, and associated hardware
• National Stock Number (nsn):
  5998-01-522-0259
• Special Features:
  Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.